? 2006 california micro devices corp. all rights reserved. 02/03/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 1 CM1220 4 and 8-channel esd pr otection arrays in csp features ? 4 and 8 channels of esd protection ? optiguard ? coated for improved reliability ? 15kv esd protection on each channel (iec 61000-4-2 level 4, contact discharge) ? 30kv esd protection on each channel (hbm) ? chip scale package features extremely low lead inductance for optimum esd protection ? 5 bump, 0.960mm x 1.330mm csp footprint for CM1220-04 ? 10 bump, 1.960mm x 1.330mm csp footprint for CM1220-08 ? lead-free version available applications ? lcd and camera datalines in mobile handsets ? i/o port protection for mobile handsets, notebook computers, pdas, etc. ? keypads and buttons ? wireless handsets ? handheld pcs/pdas ? lcd and camera modules product description california micro devices' CM1220 esd protection arrays are available in four and eight channel configu- rations. each esd channel features a nominal capaci- tance of 14pf making these devices ideal for protecting high speed i/o ports and lcd and camera data lines without significantl y affecting signal integrity. the CM1220 integrates avalanche-type esd diodes on every channel, providing a very high level of protec- tion for sensitive electronic components that may be subjected to electrostatic discharge (esd). these diodes safely dissipate esd strikes of 15kv, exceed- ing the maximum requirement of the iec61000-4-2 international standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, these devices protect for contact dis- charges at greater than 30kv. these devices are particularly well-suited for portable electronics (e.g. wireless handsets, pdas, notebook computers) because of their small package and easy- to-use pin assignments. in particular, the CM1220 is ideal for protecting high speed i/o ports and data and control lines for the lcd display and camera interface in mobile handsets. these devices incorporate cmd?s optiguard ? coating for improved reliability at assembly. the CM1220 is available in a space-saving, low-profile chip scale packages with optional lead-free finishing. electrical schematic b2, b6 esd_1 gnd a5 a7 a1 a3 esd_2 esd_3 esd_4 esd_5 c5 c7 c1 c3 esd_6 esd_7 esd_8 CM1220-08 b2 esd_1 gnd c1 c3 a1 a3 esd_2 esd_3 esd_4 CM1220-04
? 2006 california micro devices corp. all rights reserved. 2 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 02/03/06 CM1220 ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices are specified by using a " + " character for the top side orientation mark. pin descriptions CM1220-08 CM1220-04 description CM1220-08 CM1220-04 description pins name pins name pins name pins name a1 esd1 a1 esd1 esd channel c1 esd5 c1 esd3 esd channel a3 esd2 a3 esd2 esd channel c3 esd6 c3 esd4 esd channel a5 esd3 ?? esd channel c5 esd7 ?? esd channel a7 esd4 ?? esd channel c7 esd8 ?? esd channel b2 gnd b2 gnd device ground b6 gnd ?? device ground l208 5 17 36 2 c b a orientation marking(see note 2) a3 a1 orientation marking a5 b6 b2 c5 c3 a7 c7 c1 a1 a1 a3 c3 c1 b2 orientation marking a1 j 23 1 c b a orientation marking (see note 2) package / pinout diagrams CM1220-04 5 bump csp package top view bottom view (bumps down view) (bumps up view) notes: 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. CM1220-08 10 bump csp package with optiguard ? with optiguard ? part numbering information bumps package standard finish lead-free finish 2 ordering part number 1 part marking ordering part number 1 part marking 5 csp CM1220-04cs j CM1220-04cp j 10 csp CM1220-08cs l208 CM1220-08cp l208
? 2006 california micro devices corp. all rights reserved. 02/03/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 3 CM1220 specifications note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gn d, one at a time. unused pins are left open. these parameters are guaranteed by design and characterization. performance information diode characteristics (nominal cond itions unless specified otherwise) figure 1. typical diode capacitance vs. input voltage (normalized to 2.5vdc) absolute maximum ratings parameter rating units storage temperature range -65 to +150 c standard operat ing conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics (see note 1) symbol parameter conditions min typ max units c diode diode (channel) capacitance at 2.5vdc reverse bias, 1mhz, 30mvac 11 14 17 pf v diode diode standoff voltage i diode = 10 a6.0v i leak diode leakage current v in = + 3.3v (reverse bias voltage) 0.1 1 a v sig signal clamp voltage positive clamp negative clamp i diode = 10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 note 2 30 15 kv kv r dyn dynamic resistance positive negative 2.3 0.9 capacitance (normalized) dc voltage
? 2006 california micro devices corp. all rights reserved. 4 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 02/03/06 CM1220 application information refer to application no te ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 2. recommended non-solder mask defined pad illustration figure 3. eutectic (snpb) solder ball reflow profile figure 4. lead-free (snagcu) solder ball reflow profile printed circuit boar d recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature for eutectic de vices using a eutectic solder paste 240c maximum soldering temperature for lead-free devices using a lead-free solder paste 260c solder mask opening 0.325mm dia. non-solder mask defined pad 0.275mm dia. solder stencil opening 0.330mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2006 california micro devices corp. all rights reserved. 02/03/06 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 5 CM1220 mechanical details the CM1220 is supplied in custom chip scale pack- ages (csp) depending on the channel count. dimen- sions for these packages are presented in the following pages. CM1220-04cs/cp mechanical specifications mechanical dimensions for the CM1220-04cs/cp are presented below. package dimensions for CM1220-04cs/cp chip scale package csp tape and reel specifications figure 5. tape and reel mechanical data package dimensions package custom csp bumps 5 dim millimeters inches min nom max min nom max a1 0.915 0.960 1.005 0.0360 0.0378 0.0396 a2 1.285 1.330 1.375 0.0506 0.0524 0.0541 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.245 0.250 0.255 0.0096 0.0098 0.0100 b3 0.430 0.435 0.440 0.0169 0.0171 0.0173 b4 0.430 0.435 0.440 0.0169 0.0171 0.0173 c1 0.180 0.230 0.280 0.0071 0.0091 0.0110 c2 0.180 0.230 0.280 0.0071 0.0091 0.0110 d1 0.575 0.644 0.714 0.0226 0.0254 0.0281 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams dimensions in millimeters a b c 12 c1 b1 a1 b3 c2 d1 d2 a2 bottom view side view 3 b2 b4 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating optiguard ? coated csp part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 CM1220-04 1.33 x 0.96 x 0.644 1.42 x 1. 07 x 0.740 8mm 178mm (7") 3500 4mm 4mm to p for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative to l e r a n c e o n ta p e a o b o
? 2006 california micro devices corp. all rights reserved. 6 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 02/03/06 CM1220 mechanical details (cont?d) CM1220-08cs/cp mechanical specifications mechanical dimensions for the CM1220-08cs/cp are presented below. package dimensions for CM1220-08cs/cp chip scale package csp tape and reel specifications figure 6. tape and reel mechanical data package dimensions package custom csp bumps 10 dim millimeters inches min nom max min nom max a1 1.915 1.960 2.005 0.0754 0.0772 0.0789 a2 1.285 1.330 1.375 0.0506 0.0524 0.0541 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.245 0.250 0.255 0.0096 0.0098 0.0100 b3 0.430 0.435 0.440 0.0169 0.0171 0.0173 b4 0.430 0.435 0.440 0.0169 0.0171 0.0173 c1 0.180 0.230 0.280 0.0071 0.0091 0.0110 c2 0.180 0.230 0.280 0.0071 0.091 0.0110 d1 0.575 0.644 0.714 0.0226 0.0254 0.0281 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a b c 1 c1 b1 a1 c2 dimensions in millimeters d1 d2 a2 bottom view side view 3 b2 b4 57 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating b3 optiguard ? coated csp 26 part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 CM1220-08 1.96 x 1.33 x 0.644 2.08 x 1. 45 x 0.740 8mm 178mm (7") 3500 4mm 4mm to p for tape feeder reference cover ta p e p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
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